Title:
積層基板、積層体の製造方法、積層体、電子デバイス用部材付き積層体、電子デバイスの製造方法
Document Type and Number:
Japanese Patent JP7140158
Kind Code:
B2
Abstract:
To provide a laminated substrate which prevents peeling of a polyimide film to be formed when the polyimide film is formed by coating polyimide varnish onto a surface of the laminated substrate.SOLUTION: A laminated substrate has a glass support base material and an adsorption layer arranged on the support base material, in which there is a peripheral region where the adsorption layer is not arranged on a surface on the side of the adsorption layer of the support base material, the adsorption layer has a first main surface on the side of the support base material, a second main surface opposite to the first main surface and an end face connected to the first main surface and the second main surface, the end face is an inclined surface projecting from the second main surface toward the first main surface, and an angle formed by the inclined surface and the first main surface is less than 10° .SELECTED DRAWING: None
Inventors:
Shuma Kawasaki
Application Number:
JP2020099427A
Publication Date:
September 21, 2022
Filing Date:
June 08, 2020
Export Citation:
Assignee:
AGC Inc.
International Classes:
B32B17/10; B32B3/02; C03C17/34; H05K1/02
Domestic Patent References:
| JP2018099802A | ||||
| JP2016111010A |
Foreign References:
| WO2018092688A1 | ||||
| WO2015133599A1 | ||||
| WO2019142750A1 |
Attorney, Agent or Firm:
Hideaki Ito
Hirohisa Hachiya
Hirohisa Hachiya