Title:
積層型電子部品およびその実装構造体
Document Type and Number:
Japanese Patent JP6585340
Kind Code:
B2
More Like This:
Inventors:
Michiaki Nishimura
Yasunao Shigenaga
Yasunao Shigenaga
Application Number:
JP2014208149A
Publication Date:
October 02, 2019
Filing Date:
October 09, 2014
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01G4/30; H01G2/06
Domestic Patent References:
| JP2014022721A | ||||
| JP2006278557A | ||||
| JP2014027085A | ||||
| JP2013065820A | ||||
| JP55099175U | ||||
| JP60133668U |