PURPOSE: To laminate a dry resist film on a board without entrainment of bubbles in a resist layer or fluff even when a base film is thick.

CONSTITUTION: A resist layer 33 and an intermediate layer 32 are cut in the size of a board size or less except a base film 31 before laminating in a resist layer cut part E. A dry resist film 1 is cut between the laminated boards of the film 1 at the film cut part H between the boards. The resist layer 33a and the intermediate layer 32a out of the cut part of the layer 11 are released together with the film 31 of the film 1 laminated on the board 2 at the film removed part I.