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Title:
LAMINATION CHIP COMPONENT AND LAMINATION CHIP COMPONENT STACKED BODY
Document Type and Number:
Japanese Patent JP2016192466
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a laminated chip component and a laminated chip component stacked body which can reduce the man-hour and cost when a stacked body is formed by laminating chip components, and easily replace the laminated chip components and change the number of components.SOLUTION: A laminated chip component stacked body 1 is formed by laminating and connecting two laminated chip components 2 so that protrusions 41, 42 are fit into recesses 51, 52. The laminated chip component 2 comprises: a stacked body 20 which is formed in the substantially rectangular parallelepiped shape; the two protrusions 41, 42 which are formed on the upper surface of the stacked body 20; the two recesses 51, 52 which are formed on the bottom surface; and a pair of external electrodes 61, 62 which is formed so that at least a portion covers the surfaces of the protrusions 41, 42 and the recesses 51, 52. The protrusions and the recesses are formed so that the outer edge of the protrusion substantially matches the inner edge of the recess when viewed from a direction vertical to the upper surface and the bottom surface.SELECTED DRAWING: Figure 1

Inventors:
KAWAHARA TATSUMASA
Application Number:
JP2015070967A
Publication Date:
November 10, 2016
Filing Date:
March 31, 2015
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G4/30; H01G4/12; H01G4/232
Domestic Patent References:
JPS6324822U1988-02-18
JP2001332424A2001-11-30
JP2012134190A2012-07-12
JP2011018724A2011-01-27
JPH01207918A1989-08-21
JPS63131116U1988-08-26
JPS62279645A1987-12-04
JPS57971U1982-01-06
JPS55173129U1980-12-12
Attorney, Agent or Firm:
Kazuhiro Ueda