Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
真空積層装置による積層成形方法
Document Type and Number:
Japanese Patent JP4979611
Kind Code:
B2
Abstract:

To provide a molding process which allows a lamination member nicely occupying grooves of a laminating object despite using no tough-treating fluid member but a conveying support.

A laminating object 21 with a concave-convex surface of 0.2 mm or more flute width and 0.1-0.4 mm groove depth, a lamination member 20 and an elastic member 19 are put in this order and held tight between two conveying supports 17, 18 and are brought in a chamber 8; wherein the chamber 8 of a vacuum lamination device 1 is equipped with a suction means, a compression means and a heating means respectively on opposed open-and-shut surfaces of a top plate 2 and a floor plate 3. The chamber 8 is closed airtight, inside of the chamber 8 is vacuumed by the suction means, then the laminating object 21 and the lamination member 20 are compressed and heated by the compression means and the heating means through the conveying support 18 and the elastic member 19, thereby the molding is carried out so that the lamination member 20 would occupy inside the groove of the concave-convex face of laminating object 21.

COPYRIGHT: (C)2009,JPO&INPIT


Inventors:
Katsuyuki Sakakibara
Takayuki Yamamoto
Application Number:
JP2008035469A
Publication Date:
July 18, 2012
Filing Date:
February 18, 2008
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Meiki Seisakusho Co., Ltd.
International Classes:
B29C43/18; B29C43/34; B29C43/56; B29C65/02; B29K21/00; B29K101/10; B29L9/00
Domestic Patent References:
JP2002120100A
JP2001113549A
JP11235754A
JP2000101117A
Foreign References:
WO2007142290A1



 
Previous Patent: JPS4979610

Next Patent: JPS4979612