Lamination of a thin film - Sharp Corporation

Title:

Lamination of a thin film

Document Type and Number:

Japanese Patent JP5916804

Kind Code:

B2

Abstract:

A method of growing a thin film comprises growing a thin film by conformally forming at least one layer over a substrate having structures extending from a surface of the substrate, whereby the or each layer is formed over the surface of the substrate and over the structures extending from the surface. The thickness of the conformal layer, or the sum of the thicknesses of the conformal layers, is at least half the average spacing of the structures, and; at least one of the height of the structures, the average spacing of the structures and the size of the smallest dimension of the structures is set so as to provide an enhanced growth rate for the or each conformal layer (compared to the growth rate over a planar substrate).

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Inventors:

Christian Lang
Yang Jiang James Juan
Thomas Heinz Helmut Aldebaumer
Stefandy
Jonathan Heffernan

Application Number:

JP2014140807A

Publication Date:

May 11, 2016

Filing Date:

July 08, 2014

Export Citation:

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Assignee:

Sharp Corporation

International Classes:

H01L31/0352; H01L21/205; H01L31/075

Domestic Patent References:

JP2006261666A
JP3151672A
JP2008135740A

Attorney, Agent or Firm:

Harakenzo world patent & trademark

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