Title:
ランプ装置及びランプの製造方法
Document Type and Number:
Japanese Patent JP6468808
Kind Code:
B2
Abstract:
The invention relates to an integrated lamp device and a method used for producing the integrated lamp device. The integrated lamp device comprises a lamp filament assembly used for producing lamp filaments producing heat; a heat-resistant reinforcing part, one end of which is fixedly coupled with the lamp filament assembly; a lead protection sleeve pipe, one end of which is fixedly coupled with the other end of the heat-resistant reinforcing part; a fixing part, which is fixedly coupled with the other end of the lead protection sleeve pipe; and a lead. One end of the lead is electrically connected with the lamp filament assembly, and can pass through the heat-resistant reinforcing part, the lead protection sleeve pipe, and the reinforcing part sequentially, and the other end of the lead is extended out of the fixing part. By adopting the integrated lamp device, the inconvenience of the workers of installing the lamp on the jack can be removed, and the service lifetime of the lamp can be prolonged.
Inventors:
Lee Sung Young
Jan Sung Wook
Jisanghyun
Yoon Doo Young
Jan Sung Wook
Jisanghyun
Yoon Doo Young
Application Number:
JP2014224961A
Publication Date:
February 13, 2019
Filing Date:
November 05, 2014
Export Citation:
Assignee:
AP Systems, Inc.
International Classes:
H01K1/44; H01K1/46; H01K3/20; H01K7/00; H01L21/26
Domestic Patent References:
| JP4031253U | ||||
| JP6050236U | ||||
| JP11007920A |
Foreign References:
| US4785218 |
Attorney, Agent or Firm:
Maeda patent office