Title:
LAMP PROCESSING APPARATUS AND METHOD OF PROCESSING LAMP
Document Type and Number:
Japanese Patent JP2001351875
Kind Code:
A
Abstract:
To prevent failure in thermal treatment on a wafer even when a lamp 1 burns out, in a lamp processing apparatus for performing thermal treatment on the wafer 10.
On a disc 2 having a plurality of the lamps 1 disposed on a plurality of concentric circles even when any one of the lamps 1 burns out during treatment of the wafer, illumination is increased on lamps A, B, C, D, E, and F that are adjacent to the burned lamp to make up for illumination of a wafer region corresponding to the burned lamp, thereby achieving an even illumination distribution of the wafer.
Inventors:
SHIRAKI SEIICHI
Application Number:
JP2000174247A
Publication Date:
December 21, 2001
Filing Date:
June 09, 2000
Export Citation:
Assignee:
KYUSHU NIPPON ELECTRIC
International Classes:
H01L21/205; H01L21/26; H05B3/00; H05B37/03; G01R31/02; (IPC1-7): H01L21/26; G01R31/02; H01L21/205; H05B3/00
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)