急速熱処理チャンバ用のランプ - APPLIED MATERIALS,INCORPORATED

Title:

急速熱処理チャンバ用のランプ

Document Type and Number:

Japanese Patent JP5865531

Kind Code:

B2

Abstract:

A lamp assembly adapted for use in a substrate thermal processing chamber to heat the substrate to temperatures up to at least about 1100° C. is disclosed. In one embodiment, the lamp assembly comprises a bulb enclosing at least one radiation generating filament attached to a pair of leads, a lamp base configured to receive the pair of leads, a sleeve having a wall thickness of at least about 0.013 inches and a potting compound having a thermal conductivity greater than about 100 W/(K-m).

Inventors:

Lanish, joseph michael
Solubuji, Kurshed

Application Number:

JP2015032788A

Publication Date:

February 17, 2016

Filing Date:

February 23, 2015

Export Citation:

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