To provide a land capable of suppressing the occurrence of position deviation at a position where a surface mount is bonded during the bonding of the surface mount on a circuit mounting substrate, and of solder bonding the surface mount accurately at a given position.

The land 1L comprises a first land 11L and a second land 12L. The second land 12L comprises side surfaces 31a, 31b that are provided inward in the axial direction X of the first land 11L in integration with the first land 11L, and taper inward in the axial direction X. The side surfaces 31a, 31b are formed to straddle bottom side surfaces 41a, 41b of a chip resistor 3. Angles 42a to 42d on the inward side on the bottom face of electrodes 4L, 4R are all positioned inside the second lands 12L and 12R. The motion of the angle 42a both in the normal direction along the widthwide direction Y and in the normal direction along the widthwide direction X is physically limited by the side surface 31a.