Title:
LAP MATERIAL BONDING APPARATUS
Document Type and Number:
Japanese Patent JP3138425
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To efficiently perform the replacing work and position and posture regulating work of a bonding roll.
SOLUTION: Bonding rolls 77 are displaced along the guide groove (displacing guide) 79A formed to a holder 75A to be adjusted in the individual positions and postures thereof. Since the guide groove 79A has a circular arc shape, the pressing surface to the corner part of a work W of the bonding rolls 7 passes the center P of a circular arc necessarily even if the bonding rolls 77 are displaced to any position and the mutual positional adjustment of the bonding rolls 77 becomes unnecessary. When the holder 75A to which the bonding rolls 77 are set are positioned in matching relation to the work W, all of the bonding rolls 77 are simultaneously aligned with the corner part of the work W. Since it is unnecessary to individually regulating the positions and postures of the individual bonding rolls 77, replacing workability is excellent.
Inventors:
Hebei Jin
Application Number:
JP10824596A
Publication Date:
February 26, 2001
Filing Date:
April 26, 1996
Export Citation:
Assignee:
Amitech Co., Ltd.
International Classes:
B32B37/00; B29C63/02; (IPC1-7): B29C63/02
Domestic Patent References:
| JP5573552A | ||||
| JP5544806A | ||||
| JP623842A | ||||
| JP8238741A | ||||
| JP60130021U | ||||
| JP57134134U | ||||
| JP57171647U | ||||
| JP57134135U |
Attorney, Agent or Firm:
Kazuo Gero (1 person outside)