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Title:
LAPPING DEVICE
Document Type and Number:
Japanese Patent JPH08309652
Kind Code:
A
Abstract:

PURPOSE: To provide a lapping device whereby improved productivity can be expected by improving accuracy of machining of a cylindrical internal diametric surface of a workpiece to obtain the internal diametric surface of high quality.

CONSTITUTION: A device has a head stock 10 of drive rotating a workpiece provided on a base stand 2 to have an internal diametric surface Wa serving as a machined part, lapping head part 40 provided with a lap arm 47 moved between an operation position of pressing a polishing tape T to the internal diametric surface Wa of the drive rotated workpiece W and a refuge position separated from the internal diametric surface Wa and a polishing tape rewinding device 50 of collecting the polishing tape T supplied from a delivery reel 23 to the lapping head part 40.


Inventors:
KAMIKUBO MUNEYA
Application Number:
JP11619695A
Publication Date:
November 26, 1996
Filing Date:
May 15, 1995
Export Citation:
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Assignee:
YASUNAGA KK
MITSUBISHI MOTORS CORP
International Classes:
B24B21/00; B24B21/14; (IPC1-7): B24B21/00; B24B21/14
Domestic Patent References:
JP3029255B
JPH0647660A1994-02-22
JP61071346B
JPH06114714A1994-04-26
JPS63232952A1988-09-28
Attorney, Agent or Firm:
Tajiro Taiji (1 person outside)



 
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