PURPOSE: To enable to lap the surface other than plane surface by a method wherein a mechanism, by which a work holding table is tree-dimensionally moved relative to a rotary lapping roller, is provided for lapping non-plane surface of semiconductor and the like.
CONSTITUTION: The rotary roller 2 is rotatingly driven by means of a drive motor 6. The work holding table 3 arranged at the lower surface of the rotary roller 2 is supported by a supporting frame 8, on the lower surface of which a gear 8a is formed. A worm screw 10 and the gear 8a are engaged with each other so as to move the work holding table back and forth toward the direction of X-axis by means of a drive motor 9. A similar mechanism is provided for moving the work holding table 3 back and forth toward the direction of Z-axis. The work holding table 3 is moved in the supporting frame 8 toward the direction of X-axis by means of an oil-hydraulic or pneumatic cylinder 11 provided on the lower surface of the work holding table 3. An arbitrarily curved surface is lapped by moving the work holding table 3 toward the directions of X- and Z-axes while the work holding table 3 is pressed against the rotary roller 2 by means of the pneumatic cylinder 11.
SEKIKAWA SHIYOUHEI
GEMA AKIRA
| JPS5554175A | 1980-04-21 |
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