Title:
ラップ盤の製造方法
Document Type and Number:
Japanese Patent JP4155872
Kind Code:
B2
Abstract:
A method for manufacturing a lapping board having abrasive grains fixed on its surface, which is performed by the steps of: preparing a rotatable metal board having a surface of soft metal, an abrasive slurry-supplying tool arranged over the surface of the metal board, an abrasive-pressing tool which is placed on the metal board and has a hard surface, and a ultrasonic oscillation-generating tool attached to either or both of the abrasive-pressing tool and the metal board; rotating the metal board while supplying an abrasive slurry onto the surface of the metal board and while supplying electric power to the ultrasonic oscillation-generating tool to generate and apply ultrasonic oscillation to either or both of the abrasive-pressing tool and the metal board, whereby introducing the supplied abrasive slurry between the metal board and the abrasive-pressing tool and partly embedding some abrasive grains onto the metal board; and removing unfixed abrasive grains from the metal board.
Inventors:
Kazumasa Onishi
Application Number:
JP2003148163A
Publication Date:
September 24, 2008
Filing Date:
May 26, 2003
Export Citation:
Assignee:
Kazumasa Onishi
International Classes:
B24D3/00; B24B37/12; B24D7/06; B24D13/14; B24D18/00
Domestic Patent References:
| JP10249714A | ||||
| JP64061397A | ||||
| JP4132691A | ||||
| JP7299737A | ||||
| JP9201761A |
Foreign References:
| WO2007034808A1 |
Attorney, Agent or Firm:
Yanagawa Yasuo