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Patent Searching and Data


Title:
LAPPING REAMER
Document Type and Number:
Japanese Patent JP2008119813
Kind Code:
A
Abstract:

To provide a lapping reamer which loses no diameter-adjustable reamer function and inhibits diamonds from being wasted in an undesired site by solving the problem with a conventional reamer wherein diamonds (including borazons) are deposited on a slit section to narrow the width of a slit groove.

The lapping reamer adjusts the diameter of a reamer section by making use of a few lines of slits 10 arranged on the cylindrical reamer section. Granular diamonds 9 or a borazons are temporarily tacked on a reamer base material in a plurality of lines and a plurality of steps with designated intervals by making use of an adhesive between a few lines of slits arranged on the reamer base material, and the diamonds or borazons are firmly fixed by brazing and soldering.


Inventors:
TAKEZAWA EIJI
Application Number:
JP2006332555A
Publication Date:
May 29, 2008
Filing Date:
November 13, 2006
Export Citation:
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Assignee:
TAKEZAWA SEIKI KK
International Classes:
B24D7/18; B23D77/08; B24D3/00; B24D3/06