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Patent Searching and Data


Title:
LAPPING TRANSFER METHOD
Document Type and Number:
Japanese Patent JPH11334292
Kind Code:
A
Abstract:

To mold sharp and deep pattern in obtaining decoration material or the like by a lapping transfer method.

The transfer method is to transfer a transfer layer to pillar base material B by the use of a transfer sheet S comprising a support body sheet 1 and a transfer layer 2. In this case, a transfer sheet S with a transfer layer formed of a transfer layer comprising at least a peeling layer is prepared in a support body sheet 1 adhered to the base material sheet in the form irregular pattern 4 where resin is cured through irradiation of ionizing radiation in a state of liquid ionizing radiation curable type resin (uncured composition) filled in the recessed part of a roll-recessed plate and resin held between the base material sheet 3 and the roll-recessed plate by allowing a base material sheet 3 to be in contact with resin. Then, the transfer sheet S is compressed and laminated in turn by a roll to a plural lateral surfaces of the pillar base material, and thereafter the support body is peeled, and subsequently a transfer layer having a peeling layer is transferred to the outermost layer after transfer, thus molding irregular pattern 4A in the transfer layer.


Inventors:
NEZU MICHIKO
MATSUKURA TETSUO
Application Number:
JP15868098A
Publication Date:
December 07, 1999
Filing Date:
May 25, 1998
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B44C1/165; (IPC1-7): B44C1/165
Attorney, Agent or Firm:
Satoshi Kanayama