LARGE-CURRENT CIRCUIT BOARD AND MANUFACTURE THEREOF

Title:

LARGE-CURRENT CIRCUIT BOARD AND MANUFACTURE THEREOF

Document Type and Number:

Japanese Patent JP3286058

Kind Code:

B2

Abstract:

PURPOSE: To provide a low-cost printed-circuit board which fasteners does not necessarily require thin and thick portions fasteners.
CONSTITUTION: A conductive cylinder 11 has one end with a flared flange 11b to be engaged with a printed-circuit board 3 and a bus bar 5. The other end of the cylinder is inserted into a jig 12 and caulked by an axial pressure.

Inventors:

Einosuke Adachi
Masatoshi Sunamoto
Toshifumi Kimura

Application Number:

JP878394A

Publication Date:

May 27, 2002

Filing Date:

January 28, 1994

Export Citation:

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Assignee:

Mitsubishi Electric Corporation

International Classes:

H05K1/02; H05K1/14; H05K7/06; H05K3/32; (IPC1-7): H05K1/02; H01R12/04; H05K1/14

Domestic Patent References:

JP2159787A
JP437087A
JP52101949U
JP5413551Y1

Attorney, Agent or Firm:

Hiroaki Tazawa (1 person outside)

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