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Title:
LASER BEAM IRRADIATION APPARATUS AND LASER BEAM SCRIBING METHOD
Document Type and Number:
Japanese Patent JP2007021557
Kind Code:
A
Abstract:

To provide a laser beam irradiation apparatus capable of scribing a work with high productivity, and a laser beam scribing method using the laser beam irradiation apparatus.

The laser beam irradiation apparatus 100 comprises a laser beam source 101, a condensing lens 103 for condensing laser beams, a Z-axis slide mechanism 104 capable of moving the condensing lens 103 in the Z-axis direction, an X-axis slide part 108 and a Y-axis slide part 106 capable of moving a stage 105 with a substrate W placed thereon in a plane substantially orthogonal to the optical axis 101a, a lens control part 122 for controlling the Z-axis slide mechanism 104, a stage control part 123 for controlling the X-axis slide part 108 and the Y-axis slide part 106, and a main computer 120 for integrally controlling a laser beam control part 121, the lens control part 122 and the stage control part 123 with each other. By oscillating the condensing lens 103 in the Z-axis direction, the laser beam condensing area is oscillated in the thickness direction of the substrate W to irradiate laser beams.


Inventors:
KUROKI YASUNOBU
UMETSU KAZUNARI
Application Number:
JP2005000209551
Publication Date:
February 01, 2007
Filing Date:
July 20, 2005
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B23K26/08; B23K26/364; B26D9/00; H01L21/301; B23K101/40
Attorney, Agent or Firm:
上柳 雅誉
藤綱 英吉
須澤 修