To eliminate the need of the turnover of a substrate and also to reduce the occupancy area of a laser beam machine itself in carrying-out and in of the substrate to/from the laser beam machine.
This laser beam machine 1 includes: a retaining mechanism 2 for keeping the substrate 9 facing the surface to be machined upward so as not to be moved; a machining nozzle 3 which travels in the Y-axis direction, from which a laser beam is emitted onto the surface to be machined of the substrate 9 and which is also movable in the X-axis direction; a dust collecting nozzle 5 which travels in the Y-axis direction by following up the travel of the machining nozzle 3; and a supporting mechanism 4 which is relatively movable in the X-axis direction to the substrate 9 while supporting the substrate 9 from the lower part. In this laser beam machine 1, the laser beam machining is performed as travelling the machining nozzle 3 and a dust collecting nozzle 5 without moving the substrate 9 during the laser beam machining and the dust produced from the machining region, where is irradiated with the laser beam, is sucked. When moving the machining nozzle 3 by pitch feeding in the X-axis direction, the supporting mechanism 4 is also moved in the X-axis direction and interference between the supporting mechanism 4 and the laser beam axis is evaded.
NISHI NORIO
TAKEDA NOBUYUKI
YAMAGISHI NORIHIRO
SUZUKI MASAMI
| JPH0715170U | 1995-03-14 | |||
| JPH0596329A | 1993-04-20 | |||
| JPH1197824A | 1999-04-09 | |||
| JP2003313739A | 2003-11-06 | |||
| JP2002160079A | 2002-06-04 |
Takeshi Miyazawa