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Title:
LASER BEAM MACHINING APPARATUS AND LASER BEAM MACHINING METHOD
Document Type and Number:
Japanese Patent JP2010046686
Kind Code:
A
Abstract:

To provide a laser beam machining apparatus which can improve the production efficiency while preventing the leakage of laser beams, and a laser beam machining method.

A laser beam machining apparatus 1 includes a laser beam irradiation device 2 which applies laser beams to a workpiece W to machine the workpiece W, and a workpiece machining chamber 4 which houses a laser beam irradiation device 2 and prevents laser beams applied from the laser beam irradiation device 2 from being leaked to the outside of the laser beam machining apparatus 1. A first carrying-in/carrying-out port 45 through which the workpiece W is passed is provided in the floor F of the workpiece machining chamber 4. The laser beam machining apparatus 1 further includes a workpiece carrying-in/carrying-out device 6 that carries the workpiece W in the workpiece machining chamber 4 through the first carrying-in/carrying-out port 45 from the outside of the workpiece machining chamber 4 and carries out the workpiece W from the workpiece machining chamber 4 to the outside of the workpiece machining chamber 4.


Inventors:
MATSUDA SHOGO
IKEDA SHINJI
Application Number:
JP2008212619A
Publication Date:
March 04, 2010
Filing Date:
August 21, 2008
Export Citation:
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Assignee:
HONDA MOTOR CO LTD
International Classes:
B23K26/00
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi