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Title:
LASER BEAM MACHINING APPARATUS
Document Type and Number:
Japanese Patent JP2005254314
Kind Code:
A
Abstract:

To suppress influence of fluctuation of a light receiving quantity incidental to machining conditions, in a laser beam machining apparatus capable of monitoring a machining state.

The apparatus is equipped with: a laser oscillator that oscillates a laser beam for machining a workpiece; a focus head by which the laser beam outputted from the laser oscillator is focused on the workpiece; a photodetector that detects light from the workpiece produced by the irradiation of the laser beam and reference light from a reference light producing means, through a nozzle mounted on the focus head; a correlation adjusting means that adjusts correlation between the detected quantity of light in the actual machining and the machining state of the workpiece, on the basis of the reference light value detected by the photodetector; and a controller that controls the laser oscillator by monitoring the machining state of the workpiece, from the detected quantity of light in the actual machining as adjusted by the correlation adjusting means.


Inventors:
Iwata, Takaaki
Otsuki, Tetsuya
Application Number:
JP2004000072256
Publication Date:
September 22, 2005
Filing Date:
March 15, 2004
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K26/00; H01J40/14; (IPC1-7): B23K26/00
Attorney, Agent or Firm:
高橋 省吾
稲葉 忠彦
村上 加奈子
中鶴 一隆