To provide a laser beam machining apparatus capable of facilitating calculation of a conversion expression on a space light phase modulator while the space light phase modulator is used for a beam shaping device.
The laser beam machining apparatus 1 for processing a wafer 9 includes a laser oscillator 2 for outputting a primary laser beam, and a beam shaping device 3 formed so as to executing a plurality of shaping processes for forming a plurality of laser beams B2 from the primary laser beam B1. The beam shaping device 3 has a plurality of space light phase modulators 31, 32, and each of the space light phase modulators 31, 32 takes charge of one of the plurality of shaping processes. Respective space light phase modulators 31. 32 are formed to modulate a phase of output light to a phase of input light.
Samejima Mutsumi
Yasushi Ohata
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