LASER BEAM MACHINING DEVICE, METHOD OF MACHINING WORKPIECE, AND METHOD OF DIVIDING WORKPIECE

Title:

LASER BEAM MACHINING DEVICE, METHOD OF MACHINING WORKPIECE, AND METHOD OF DIVIDING WORKPIECE

Document Type and Number:

Japanese Patent JP2012076093

Kind Code:

A

Abstract:

To achieve more certain division of a workpiece configured by forming a dissimilar material layer on a substrate.

A machining method for forming a division starting point on a workpiece includes: a placing step of placing the workpiece on a stage movable to the first and second directions; a preliminary machining step of exposing a base substrate in a region to be irradiated by irradiating with a laser beam for preliminary machining emitted from a prescribed light source while moving the stage to the first direction; and a regular machining step of generating cleavage or parting of the base substrate between the regions to be irradiated by irradiating the workpiece with the laser beam for regular machining while moving the stage to the second direction in such a manner that in the laser beam for regular machining which is an ultrashort pulsed light having a pulse width of a picosecond order emitted from a prescribed light source, the region to be irradiated for each unit pulsed light is formed discretely in the exposed portion of the base substrate.

Inventors:

NAGATOMO SHOHEI
NAKATANI IKUYOSHI
SUGATA MITSURU

Application Number:

JP2010221589A

Publication Date:

April 19, 2012

Filing Date:

September 30, 2010

Export Citation:

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Assignee:

MITSUBOSHI DIAMOND IND CO LTD

International Classes:

B23K26/364; B23K26/38; B23K26/40; B28D5/00; H01L21/301

Domestic Patent References:

JP2009182019A

2009-08-13

Foreign References:

WO2010098186A1

2010-09-02

Attorney, Agent or Firm:

Yoshitake Hidetoshi
Takahiro Arita

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