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Title:
LASER BEAM MACHINING DEVICE
Document Type and Number:
Japanese Patent JP2010207901
Kind Code:
A
Abstract:

To provide a laser beam machining device provided with a laser beam monitoring means for machining, which can guarantee reliability even for use over a long period of time, further, can effectively discriminate not only the disconnection of an optical fiber propagating a laser beam for machining but also wear or the like of an optical element incorporated into a laser beam generating source.

The laser beam monitoring means for machining comprises: an optical fiber for beam return for returning a part of a laser beam for machining propagated to the head part for machining to the device body part; and a return beam sensor which is located at the device body part, photoelectrically converts a return beam emitted from the optical fiber for beam return, and detects the same.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
HAGIWARA KENICHIRO
IWAMOTO ICHIRO
Application Number:
JP2009058973A
Publication Date:
September 24, 2010
Filing Date:
March 12, 2009
Export Citation:
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Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
B23K26/00; B23K26/064; H01S3/00
Domestic Patent References:
JP2004085310A2004-03-18
JPH07266067A1995-10-17
Attorney, Agent or Firm:
Shinichi Iizuka