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Title:
LASER BEAM MACHINING DEVICE
Document Type and Number:
Japanese Patent JP2016196018
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a laser beam machining device capable of confirming whether or not a workpiece is completely cut by ablation working, in real time during working.SOLUTION: A laser beam machining device comprises: plasma detection means 50 for detecting plasma emitted by a workpiece W by irradiation of a plurality of laser beams LB1 and LB2; and control means for determining a working state of the workpiece on the basis of detection signals PR1 and PR2 from the plasma detection means. The control means determines that the workpiece is completely cut when the plasma is detected by irradiation of a preceding laser beam which is precedently irradiated in the plurality of laser beams and the plasma is not detected by irradiation of a succeeding laser beam which is irradiated following the preceding laser beam, and determines that the workpiece is not completely cut when the plasma is detected by the irradiation of the succeeding laser beam, on the basis of the detection signals from the plasma detection means.SELECTED DRAWING: Figure 2

Inventors:
IWAMOTO TAKU
OGAWA YUKI
YOSHIKAWA TOSHIYUKI
Application Number:
JP2015076513A
Publication Date:
November 24, 2016
Filing Date:
April 03, 2015
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B23K26/38; B23K26/00; B23K26/067; H01L21/301; H01L21/66
Domestic Patent References:
JP2013173160A2013-09-05
JP2001121279A2001-05-08
JP2005131645A2005-05-26
JPH09108866A1997-04-28
Foreign References:
US20140021177A12014-01-23
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Sayaka Hirakawa
Toshiyuki Kojima



 
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