Title:
LASER PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2017064749
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a laser processing apparatus that projects a laser beam to process a surface of a workpiece, and which can accurately correct distortion of the laser beam, and can maintain the processing quality even upon the replacement of a collection lens.SOLUTION: A laser processing apparatus 1 including a laser oscillating unit 12 and a galvanometer scanner 19 is connected to a laser controller 5 and a data generator 7. At a distortion correction table updating process (S2), the following steps are performed. Using a wireless tag reader 64, a CPU 61 receives replacement lens distortion data included in lens specific data, from a wireless tag 20E of a replacement lens 20R mounted on a laser head portion 3. Using main body distortion Dm included in main body distortion data and replacement lens distortion Dr included in the received replacement lens distortion data, the CPU 61 determines the distortion of a pulse laser L at a processing position (S18), and forms a distortion correction table (S20), with the replacement lens 20R mounted on the laser head portion 3.SELECTED DRAWING: Figure 6
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Inventors:
WATANABE MITSUYOSHI
Application Number:
JP2015192490A
Publication Date:
April 06, 2017
Filing Date:
September 30, 2015
Export Citation:
Assignee:
BROTHER IND LTD
International Classes:
B23K26/082; B23K26/00; B23K26/035; B23K26/04; G02B26/10
Domestic Patent References:
| JP2003088965A | 2003-03-25 | |||
| JP2009226445A | 2009-10-08 | |||
| JP2004322127A | 2004-11-18 | |||
| JP2015044212A | 2015-03-12 | |||
| JP2008073718A | 2008-04-03 |
Attorney, Agent or Firm:
Patent business corporation NEXT
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