LASER BEAM MACHINING DEVICE

Japanese Patent JP3257489

B2

PROBLEM TO BE SOLVED: To perform such laser beam machining as surely enables conduction between close conductive layers by precisely detecting the condition of drilling, thereby controlling the machining.
SOLUTION: The laser beam machining device is equipped with an incident light detector 14 for detecting the intensity of light emitted from a laser generator 1 and with a reflection light detector 17 for detecting the intensity of reflection light from a workpiece 8, controlling a laser beam based on the comparison between the relative reflection light intensity on one part, which is calculated from the incident light intensity and the reflection light intensity detected by each detector 14, 17 and which is also corresponding to the intensity of the reflection light from the machining zone 11 of the workpiece, and a prescribed reference value on the other part; in this laser beam machining device, typically, the diffracted light of a laser beam entering the incident light detector 14 and the one entering the reflection light detector 17 are substantially equal to each other in the degree.

JP5957824	Processing system
JPH08141766	LASER MACHINING METHOD AND DEVICE THEREFOR
JP2003053572	DEVICE AND METHOD FOR LASER BEAM MACHINING

Makoto Kato
Hisashi Kinoshita
Isaji Kazuhide

JP33839897A

February 18, 2002

December 09, 1997

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Matsushita Electric Industrial Co., Ltd

B23K26/382; B23K26/00; B23K26/064; B23K26/067; H05K3/00; (IPC1-7): B23K26/00; B23K26/06; B23K26/08; H05K3/00

JP6262208A
JP62133304A
JP241789A
JP2284785A

Fumio Iwahashi (2 others)

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