Title:
Laser beam machining device
Document Type and Number:
Japanese Patent JP5969767
Kind Code:
B2
Abstract:
A method for forming a laser processed hole in a workpiece configured by bonding a transparent first member formed of a first material and a second member formed of a second material. The method includes holding the workpiece by a chuck table with a side of the first member directed upward; applying a pulsed laser beam to the workpiece from the upward side of the first member; detecting a wavelength of plasma light generated by applying the pulsed laser beam to the workpiece; and controlling the laser beam according to a detection signal from the plasma light. The plasma is detected by: passing only the wavelength of plasma light generated from the first material, and detecting the plasma light generated from the first material and outputting a light intensity signal based on the detection. The processed hole extends entirely through the first member without melting the second member.
Inventors:
Keiji Nohmaru
Yoji Moritan
Yoji Moritan
Application Number:
JP2012015806A
Publication Date:
August 17, 2016
Filing Date:
January 27, 2012
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B23K26/00; B23K26/382
Domestic Patent References:
JP2007157900A | ||||
JP8192283A |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Sachiko Okunuki