Title:
Laser beam machining device
Document Type and Number:
Japanese Patent JP6035096
Kind Code:
B2
Inventors:
Naohisa Hayashi
Seiji Shimizu
Seiji Shimizu
Application Number:
JP2012213986A
Publication Date:
November 30, 2016
Filing Date:
September 27, 2012
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B23K26/067; B23K26/064; B23K26/066; B23K26/082
Domestic Patent References:
| JP2003181673A | ||||
| JP2012503798A | ||||
| JP5196871A | ||||
| JP2011011917A |
Foreign References:
| WO2000053365A1 |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation
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