Title:
LASER BEAM MACHINING DEVICE
Document Type and Number:
Japanese Patent JPH06155062
Kind Code:
A
Abstract:
PURPOSE: To provide a laser beam machining device, by which the generation of crack is surely restrained when applying to a ceramic material, etc., and while holding the high machining precision, finally cut-off work is obtd. without dross.
CONSTITUTION: A cutter 4 is arranged on the back surface of a work 2 to a laser beam B from a laser beam generator 1 so as to automatically remove the dross D according to shifting of the work 2. Therefore, as the dross D is removed from the work 2 with the cutter 4 while the temps. of the work 2 and the dross D are yet high, by removing the dross D at the same time of cut-off-working without generating the crack in the work 2, the work 2 having good machining precision can easily be obtd.
Inventors:
KIKUCHI HIDEKAZU
TOMINAGA KAN
IYORI KIYOSHI
MIURA SHINYA
TOMINAGA KAN
IYORI KIYOSHI
MIURA SHINYA
Application Number:
JP30898892A
Publication Date:
June 03, 1994
Filing Date:
November 18, 1992
Export Citation:
Assignee:
HITACHI ELECTRONICS
HITACHI LTD
HITACHI LTD
International Classes:
B23K26/40; B23K26/16; B23K26/38; (IPC1-7): B23K26/00; B23K26/16
Attorney, Agent or Firm:
Kenjiro Take