To materialize high-speed machining with respect to laser beam machining method and apparatus therefor that perform machining by laser beam irradiation.
(a) A workpiece is held on a holding base which can move the workpiece in a first direction at a first speed at the maximum and in a second direction different from the first at a smaller-than-the-first speed at the maximum and which, when the workpiece is simultaneously moved in the first direction at the first speed as well as in the second direction at the second speed, the workpiece as a whole is moved in a third direction. (b) While being moved simultaneously in the first direction at the first speed and in the second direction at the second speed, and moved as a whole in the third direction, the workpiece held on the holding base is irradiated with a laser beam.
Mikio Kuruyama
Ukai Shinichi
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