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Title:
LASER BEAM MACHINING METHOD AND APPARATUS
Document Type and Number:
Japanese Patent JP2009208118
Kind Code:
A
Abstract:

To provide a laser beam machining method and a laser beam machining apparatus with which machining in a region where a laser beam is hardly reaches can be suitably performed and laser machining can be performed without causing a damage in a region where a laser beam easily reaches.

In the laser beam machining method and the laser beam machining apparatus, a laser beam from a laser light source is emitted to a plurality of arrayed workpieces and the periphery on a planar machining stage from a direction vertical to the surface, while scanning the irradiation position of the laser beam by an irradiation optical system, and the laser beam emitted by the irradiation optical system is reflected with a reflection member installed adjacently to each of the plurality of workpieces on the machining stage, and the side of the workpieces is irradiated. By irradiating the side of the workpieces with the laser beam reflected by the reflection member, since the side of the workpieces where the laser beam is hard to reach can be sufficiently irradiated with it without increasing the intensity, the laser beam machining can be suitably performed.


Inventors:
TAMAOKI SHINOBU
KAKUI MOTOKI
NAKAMAE KAZUO
Application Number:
JP2008053710A
Publication Date:
September 17, 2009
Filing Date:
March 04, 2008
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01B13/00; H02G1/12
Domestic Patent References:
JP2007290013A2007-11-08
JP2005211908A2005-08-11
JPH08186918A1996-07-16
JPS6471584A1989-03-16
JPS63249413A1988-10-17
JP2003002677A2003-01-08
JPH0890273A1996-04-09
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Yoshiki Kuroki
Ichira Kondo
Masatoshi Shibata