Title:
LASER BEAM MACHINING METHOD AND LASER BEAM MACHINING DEVICE
Document Type and Number:
Japanese Patent JP2005088035
Kind Code:
A
Abstract:
To provide a laser beam machining method and a laser beam machining device by which high-quality holes can be formed.
An arbitrary wavelength plate 31 is arranged on the same optical axis of a plurality of laser beams 50, 51 having a different wavelength. By rotating this wavelength plate 31, deflection direction is rotated in the plurality of leaser beams 50, 51 that are emitted to a workpiece 40. In drilling the workpiece 40 using the plurality of laser beams 50, 51, directionality of the deflection can be eliminated in the laser beams 50, 51 emitted to the workpiece 40. This, in spite of a simple device structure, makes high-quality drilling possible for a circular hole having a high out-of-roundness even in the rear side, for example.
Inventors:
HAYAKAWA TAKESHI
KAMIYA TETSUAKI
KUMAGAI EIJI
KAMIYA TETSUAKI
KUMAGAI EIJI
Application Number:
JP2003323265A
Publication Date:
April 07, 2005
Filing Date:
September 16, 2003
Export Citation:
Assignee:
DENSO CORP
International Classes:
G02B26/00; B23K26/06; B23K26/073; B23K26/382; H05K3/00; B23K101/42; (IPC1-7): B23K26/00; B23K26/06; G02B26/00
Attorney, Agent or Firm:
Kazuyuki Yahagi