Title:
LASER BEAM MACHINING METHOD
Document Type and Number:
Japanese Patent JP2017051990
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a laser beam machining method which achieves small diameter machining having a good taper rate with laser irradiation by reduction in the number of shots, and achieves machining quality and high productivity required for reduction in the size.SOLUTION: A laser beam machining method is a method for manufacturing which drills a hole in a workpiece formed by bonding an insulating resin layer and a cover film to a sheet-like base member with a laser beam includes: a step of determining a thickness of the cover film to a predetermined thickness or thicker; a step of mounting and holding the cover film side of the workpiece on a machining table as a laser irradiation surface; a step of setting pulse energy of a laser beam used in machining according to intensity of the laser beam and a pulse time width; a step of adjusting a position of a focal point of the laser beam used in machining; and a step of irradiating the insulating resin layer and the cover film with a laser pulse, simultaneously removing the insulating resin layer and the cover film, and drilling a hole.SELECTED DRAWING: Figure 1
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Inventors:
KARASAKI HIDEHIKO
SAEKI HIDEFUMI
SAKURAI MICHIO
SAEKI HIDEFUMI
SAKURAI MICHIO
Application Number:
JP2015179176A
Publication Date:
March 16, 2017
Filing Date:
September 11, 2015
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
B23K26/386; B23K26/046; H05K3/00
Attorney, Agent or Firm:
Kenji Kamada
Hiroo Maeda
Hiroo Maeda