Laser beam machining method

Japanese Patent JP5983407

B2

The present invention relates to a laser processing method that is capable of performing high-throughput processing by using an inexpensive pulsed laser light source. A pulsed laser light source 1 that is favorably used in this laser processing method has a seed light source, an amplifying optical fiber, a bandpass filter and the like, as well as a MOPA structure. The laser processing method is a method of processing a metal thin film formed on a transparent substrate by radiating pulsed light onto the metal thin film, and has the steps of repeatedly outputting the pulsed light by directly modulating a semiconductor laser of the seed light source in accordance with electric signals, amplifying the pulsed light using an optical amplifier including an optical amplification medium, controlling the full width at half maximum of the pulsed light that is amplified and outputted by the optical amplifier to be 0.5 ns or shorter, and removing the metal thin film by radiating the pulsed light thus having the controlled full width at half maximum onto the metal thin film through the transparent substrate.

Motoki Tsunoi

JP2012533982A

August 31, 2016

September 09, 2011

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Sumitomo Electric Industries, Ltd.

B23K26/36; B23K26/00; B23K26/064; H01S3/067; H01S3/10

JP2002273582A	2002-09-25
JP2003181678A	2003-07-02
JP2002033495A	2002-01-31
JP2010087041A	2010-04-15
JP2010171131A	2010-08-05
JP2010125489A	2010-06-10
JP2007158012A	2007-06-21
JP2009172629A	2009-08-06
JP2009119521A	2009-06-04
JP2002273582A	2002-09-25
JP2003181678A	2003-07-02
JP2002033495A	2002-01-31

US20060207976A1

2006-09-21

Yoshiki Hasegawa
Yoshiki Kuroki
High Kunio Ki
Shotaro Terasawa
Hiroshi Abe
Hiroto Kido

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