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Title:
LASER BEAM MACHINING METHOD
Document Type and Number:
Japanese Patent JPH04344887
Kind Code:
A
Abstract:

PURPOSE: To easily perform a desired laser beam machining even on a hard-to- work member, regardless of the size of the working member or a working area and also without staining the working member, by raising the absorption rate of a irradiating laser beam in reference to the laser machining method in which the laser machining is performed especially on a metal material having a high reflectance.

CONSTITUTION: Recessed and projecting parts are formed on the metal working face 1 for laser beam machining. For the formation of these recessed and projecting parts, various machining methods such as press forming, grinding, honing, ultrasonic working, and excimer laser beam machining are suitable. By providing the recessed and projecting parts on the metal working face, the absorption rate of the laser beam 2 is raised on an object to be worked and the desired laser beam machining is easily performed even on the hard-to-work members.


Inventors:
KUBO MASAO
NAKAMURA YOSHIMITSU
ASAHI NOBUYUKI
Application Number:
JP14781691A
Publication Date:
December 01, 1992
Filing Date:
May 23, 1991
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B21D31/00; B23K26/18; B23K26/352; (IPC1-7): B21D31/00; B23K26/00; B23K26/18
Domestic Patent References:
JPH02141525A1990-05-30
JPH0237925A1990-02-07
JPS61174280A1986-08-05
Attorney, Agent or Firm:
Michio Takayama (1 outside)



 
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