Title:
LASER BOND METHOD, LASER BOND PRODUCT AND LASER BOND DEVICE
Document Type and Number:
Japanese Patent JP2015205335
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a laser bond method and laser bond device capable of improving bond intensity, and a laser bond product acquired by the laser bond method.SOLUTION: A laser bond method comprises: a first step for radiating ultrashort pulse laser light from an upper part of a second object by first focal distance, to a portion where a first object 16 and the second object 17 disposed on the first object are brought into contact with each other, or are in proximity; and a second step for further radiating the ultrashort pulse laser light by second focal distance different from the first focal distance from the upper part of the second object, to the portion where the ultrashort pulse laser light is radiated in the first step.
Inventors:
YOSHIDA TAKASHI
SHIMANO KAORU
SHIMANO KAORU
Application Number:
JP2014088908A
Publication Date:
November 19, 2015
Filing Date:
April 23, 2014
Export Citation:
Assignee:
AISIN SEIKI
International Classes:
B23K26/21; B23K26/035; B23K26/323; B23K26/324; C04B37/02; H01L21/52
Domestic Patent References:
| JP2011517299A | 2011-06-02 | |||
| JPS53143566U | 1978-11-13 |
Attorney, Agent or Firm:
Okabe
Koji Yoshizawa
Takashi Kawasaki
Koji Yoshizawa
Takashi Kawasaki
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