Title:
LASER BONDING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT PELLET
Document Type and Number:
Japanese Patent JPS60145631
Kind Code:
A
Abstract:
PURPOSE:To bond in a relatively short time without using expensive gold by bonding a pellet of a semiconductor integrated circuit and a lead frame by laser light ray. CONSTITUTION:A lead frame 6 formed, for example, with mesh or slits is used to emit a laser light rays directly from below the lead frame which places a pellet 1 of a semiconductor integrated circuit. The pellet of the semiconductor integrated circuit has various sizes, but the hole area rate of the mesh or slits 7 of lattice shape of the portion for placing the pellet of the integrated circuit of the lead frame is sufficient with approx. 50%. Thus, the pellet 1 of the integrated circuit is placed on the lattice portion of the frame 6, a laser light ray is emitted fully to the part to place the lattice part of the leaf frame 6 and the pellet 1 of the integrated circuit and to die bond them.
Inventors:
YAMAJI TOSHIHARU
Application Number:
JP244084A
Publication Date:
August 01, 1985
Filing Date:
January 09, 1984
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/52; H01L21/58; H01L23/495; (IPC1-7): H01L21/58
Attorney, Agent or Firm:
Koshiro Matsuoka