Title:
レーザー切断装置及びレーザー切断方法
Document Type and Number:
Japanese Patent JP6811697
Kind Code:
B2
Abstract:
A laser cutting apparatus includes a laser beam irradiation apparatus configured to radiate a laser beam, a pressure wave irradiation part including a plurality of pressure wave sources configured to radiate pressure waves toward a fusing part or a section to be cut by the laser beam, and a jet injection part configured to inject jets toward the fusing part or the section to be cut along respective outer circumferential sides of the pressure waves.
Inventors:
Yoshinao Komatsu
Application Number:
JP2017182319A
Publication Date:
January 13, 2021
Filing Date:
September 22, 2017
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES,LTD.
International Classes:
B23K26/38; B23K26/14; B23K26/16
Domestic Patent References:
| JP2015178125A | ||||
| JP2017104891A | ||||
| JP63076786A | ||||
| JP2005014075A | ||||
| JP2011041963A | ||||
| JP2013075818A |
Attorney, Agent or Firm:
Yasushi Matsunuma
Eisuke Ito
Hiroyuki Hashimoto
Satoshi Koto
Koichiro Kamata
Taichi Hasegawa
Eisuke Ito
Hiroyuki Hashimoto
Satoshi Koto
Koichiro Kamata
Taichi Hasegawa