Title:
LASER DEVICE FOR SOLDER PROCESSING
Document Type and Number:
Japanese Patent JP2023123076
Kind Code:
A
Abstract:
To provide a laser device for solder processing which enables solder processing with excellent quality, even if a solder processing part is irradiated with a plurality of laser beams of different wavelengths.SOLUTION: A laser device for solder processing includes: a plurality of first laser elements for emitting a first laser beam of an infrared wavelength region; a plurality of second laser beams for emitting a second laser beam of a blue wavelength range; a condensing optical system which makes both of the first and second laser beams incident thereon; a light source module mounted with the first and second laser elements, and the condensing optical system; an optical fiber which is connected to the light source module, and makes both the first and second laser beams passing through the condensing optical system incident thereon; an irradiation head which makes the first and second laser beams propagated through the optical fiber incident thereon; an irradiation optical system which is stored inside the irradiation head and guides the first and second laser beams; and an irradiation port which irradiates a solder processing part with the first and second laser beams guided through the irradiation optical system.SELECTED DRAWING: Figure 1
Inventors:
INOUE MASAKI
Application Number:
JP2022026938A
Publication Date:
September 05, 2023
Filing Date:
February 24, 2022
Export Citation:
Assignee:
USHIO ELECTRIC INC
International Classes:
B23K1/005; B23K26/064; H01S5/02251
Attorney, Agent or Firm:
Patent Attorney Corporation Junias International Patent Office
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