Title:
LASER DICING METHOD
Document Type and Number:
Japanese Patent JP2013027887
Kind Code:
A
Abstract:
To provide a laser dicing method for optimizing an irradiation condition of a pulse laser beam to obtain excellent cleavage properties in a processed substrate of which a metal film is formed on a surface.
The laser dicing method of the processed substrate including the metal film on the surface thereof includes: a metal film separation step of placing the processed substrate on a stage and irradiating the metal film with the defocused pulse laser beam to separate the metal film; and a crack forming step of irradiating a region where the metal film of the processed substrate is separated with the pulse laser beam to form a crack on the processed substrate.
Inventors:
IDE MITSUHIRO
HAYASHI MAKOTO
SATO SHOICHI
HAYASHI MAKOTO
SATO SHOICHI
Application Number:
JP2011164041A
Publication Date:
February 07, 2013
Filing Date:
July 27, 2011
Export Citation:
Assignee:
TOSHIBA MACHINE CO LTD
International Classes:
B23K26/36; B23K26/00; B23K26/38; B23K26/40; B28D5/00; C03B33/09; H01L21/301
Domestic Patent References:
| JP2010192867A | 2010-09-02 | |||
| JP2010228007A | 2010-10-14 | |||
| JP2011147968A | 2011-08-04 | |||
| JPH07236984A | 1995-09-12 |
Foreign References:
| US20110174787A1 | 2011-07-21 |
Attorney, Agent or Firm:
Tetsuma Ikegami
Akira Sudo
Mitsuyuki Matsuyama
Akira Sudo
Mitsuyuki Matsuyama