Title:
LASER DIODE MODULE
Document Type and Number:
Japanese Patent JP2001194561
Kind Code:
A
Abstract:
To miniaturize a laser diode module itself and also to avoid that optical coupling between the tip end part of an optical fiber and the laser diode is affected by the change of an environmental temperature.
A clip 15 which fixes the tip end part of a coated optical fiber 11 to an optical coupling position to the laser diode 1 and a chip carrier 3 in which the laser diode 1 or the like is provided are inclined and fixed within a package 8, and the coated optical fiber 11 whose tip end part is fixed by the clip 15 and which is guided out at an angle according to the inclined angle of the chip carrier 3 is gently bent within the package 8 and is guided out to the outside of the package in parallel to the bottom plate 4 of the package.
Inventors:
HATTA TATSUO
Application Number:
JP2000006988A
Publication Date:
July 19, 2001
Filing Date:
January 14, 2000
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01S5/022; G02B6/42; (IPC1-7): G02B6/42; H01S5/022
Attorney, Agent or Firm:
Hiroaki Tazawa (1 person outside)