To provide a laser etching apparatus capable of freely controlling a working shape.
When a slope is desired for example with a width of 5 μm on the side wall face at an end part in the scanning direction, an opening 41 is started to be opened from a state opened by the initial dimension of 5 μm, with the rear end of the opening 41 adjusted to a scanning starting position P1, and with laser beam irradiation started simultaneously, until the opening reaches a target dimension of 10 μm SQUARE. In this instance, a controller makes the opening 41 open at a speed of 5μm/sec and scan the laser beam at a speed of 7.5 μm/sec. Then, with the opening 41 maintained at the target dimension of 10 μm SQUARE, the laser beam is scanned at a speed of 10 μm/sec. When the tip end of the opening 41 reaches 5 mm before the scanning terminating position P2, the opening 41 is started to be closed. When the opening 41 is closed to the initial dimension of 5 mm, the irradiation of the laser beam LB is stopped at the same time. Concurrently, the controller 70 makes the opening 41 close at the speed of 5 μm/sec while making the laser beam scan at the speed of 7.5 μm/sec.
NADA NAOJI
KOSHIISHI AKIRA
Yasushi Santanzaki
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