Title:
金属工作物をレーザ衝撃ピーニングする方法
Document Type and Number:
Japanese Patent JP4187267
Kind Code:
B2
Abstract:
A method of laser shock peening a metallic part by firing a laser on a laser shock peening surface of the part which has been adhesively covered by tape having an ablative medium, preferably a self adhering tape with an adhesive layer on one side of an ablative layer, while flowing a curtain of water over the surface upon which the laser beam is firing. Continuous movement is provided between the part and the laser beam while continuously firing the laser beam, which repeatably pulses between relatively constant periods, on a laser shock peening surface of the part. Using a laser beam with sufficient power to vaporize the ablative medium so that the pulses form laser beam spots on the surface and a region having deep compressive residual stresses imparted by the laser shock peening process extending into the part from the surface.
Inventors:
Mannava, Sisara Mayer
Otis, Angel Lewis, Junior
Eaton, Robert Leslie
McDaniel, Albert Everit
Roussie, Jeffrey David
Otis, Angel Lewis, Junior
Eaton, Robert Leslie
McDaniel, Albert Everit
Roussie, Jeffrey David
Application Number:
JP53908397A
Publication Date:
November 26, 2008
Filing Date:
April 25, 1997
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
B23K26/00; B23K26/073; C21D10/00; C22F3/00; C23C26/00; C21D7/06
Domestic Patent References:
| JP7248397A | ||||
| JP58120716A | ||||
| JP7246483A | ||||
| JP8206869A |
Foreign References:
| EP0666326A1 |
Attorney, Agent or Firm:
Kenichi Matsumoto