Title:
レーザー加工装置、被加工物の加工方法および被加工物の分割方法
Document Type and Number:
Japanese Patent JP5104919
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a laser beam machining device which suppresses formation of machining marks, and further can form division starting points more securely achieving the division of the workpiece.SOLUTION: The laser beam machining device includes: a light source emitting pulse laser beams; and a stage on which a workpiece is placed. The device further includes a cooling mechanism for cooling the placement face of the workpiece placed on the stage. In a state where the workpiece is placed on the stage, and also, the placement face is cooled by the cooling mechanism, while moving the stage so that the regions to be irradiated per unit pulse beam of the pulse laser beams are discretely formed in the face to be machined opposed to the mounting face, the pulse laser beams are emitted on the workpiece. In this way, the cleavages or partings of the workpiece are successively caused between the regions to be irradiated to form starting points for division in the workpiece.
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Inventors:
Nagatomo Shohei
Ikusho Nakatani
Sugita Mitsuru
Ikusho Nakatani
Sugita Mitsuru
Application Number:
JP2010166229A
Publication Date:
December 19, 2012
Filing Date:
July 23, 2010
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B23K26/38; B23K26/40; B28D5/00; C04B41/91; H01L21/301
Domestic Patent References:
| JP9029472A | ||||
| JP2009214182A | ||||
| JP2010082645A | ||||
| JP2008006492A | ||||
| JP2000270833A |
Foreign References:
| WO2005102638A1 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita