Title:
LASER MACHINING METHOD AND LASER MACHINING APPARATUS
Document Type and Number:
Japanese Patent JP2015085376
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a laser machining method that can suppress light leakage and that can increase the width of a modified layer in a thickness direction of a workpiece, and a laser machining apparatus.SOLUTION: In a laser machining method, a workpiece is irradiated with a laser beam by positioning a condensing point of the laser beam of a wavelength with transparency within the workpiece, and a modified layer is formed within the workpiece. In the laser beam, the width of a spectral line is set at 10 pm or less.
Inventors:
MORISHIGE YUKIO
IWAKI KUNIAKI
IWAKI KUNIAKI
Application Number:
JP2013228363A
Publication Date:
May 07, 2015
Filing Date:
November 01, 2013
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B23K26/38; B23K26/00; B23K26/064; B23K26/40; H01L21/301
Domestic Patent References:
| JP3408805B2 | 2003-05-19 | |||
| JP3408805B2 | 2003-05-19 |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Sayaka Masuda
Sachiko Okunuki
Sayaka Masuda