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Title:
LASER PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2014042916
Kind Code:
A
Abstract:

To provide a laser apparatus, in which diffraction light of a high order can be blocked by a simple structure when a DOE is used to branch a laser beam.

A laser processing apparatus for processing a work-piece by irradiating the same with a laser beam comprises: a work table 2; a laser beam output section 15 for outputting a laser beam; a DOE 34 for branching the laser beam from the laser beam output section 15 into a plurality of laser beams; a condenser lens 201 for condensing the laser beams from the DOE 34; a shielding plate 202 disposed between the condenser lens 201 and the work table 2 for shielding a laser beam of the DOE 34 at a predetermined or higher order; and a relay lens 203 for condensing the laser beam having passed through the shielding plate 202, on the work-piece.


Inventors:
HAYASHI NAOHISA
SHIMIZU SEIJI
Application Number:
JP2012184797A
Publication Date:
March 13, 2014
Filing Date:
August 24, 2012
Export Citation:
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Assignee:
MITSUBOSHI DIAMOND IND CO LTD
International Classes:
B23K26/064; B23K26/06; B23K26/066; B23K26/082; B23K26/382; C03B33/02; G02B26/08
Domestic Patent References:
JPH1058179A1998-03-03
JP2003181673A2003-07-02
JP2010207879A2010-09-24
JP2008188653A2008-08-21
JP2004209508A2004-07-29
JP2011011917A2011-01-20
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation