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Title:
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2015139778
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a laser processing device where hole opening processing is achieved with high speed and high quality.SOLUTION: A laser processing device comprises: a processing head (24) to irradiate a work-piece (W) with laser beams (L) and inject mist (FM) in the vicinity of the irradiation position of the work-piece (W); moving parts (22, 23) to move the processing head (24) along the work-piece (W); a laser oscillator (10) to supply the laser beams (L) to the processing head (24); a liquid supply unit (43) to supply a liquid making the mist (FM) to the processing head; and a controlling unit (30a) to control the operations of the moving parts (22, 23), the laser oscillator (10) and the liquid supply unit (43). The controlling unit (30a) turns on/off the irradiation with the laser beams (L) while moving the processing head (24) in a prescribed route and the injection of the mist (FM) corresponding to the on/off of the irradiation with the laser beams (L) when processing at the time of turning the irradiation on comes to piercing processing in the work-piece (W).

Inventors:
YOSHIKAWA NOBORU
MIZUOCHI KEN
Application Number:
JP2014012148A
Publication Date:
August 03, 2015
Filing Date:
January 27, 2014
Export Citation:
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Assignee:
AMADA HOLDINGS CO LTD
International Classes:
B23K26/146; B23K26/384
Domestic Patent References:
JPH10305387A1998-11-17
JP2007283344A2007-11-01
JPH10249563A1998-09-22
JP2013220451A2013-10-28
JPH05224727A1993-09-03
JP2008027956A2008-02-07
JP2005144557A2005-06-09
JP2004322116A2004-11-18
JPH11320142A1999-11-24
JPH10277766A1998-10-20
Foreign References:
US6201212B12001-03-13
US5902497A1999-05-11
DE102007017616B32008-09-25
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu