Title:
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2016013558
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To allow a device with a simple structure to efficiently laser process an object to be processed, and to enable the device to reliably remove and recover cutting debris.SOLUTION: The laser processing device has a processing head 3 including: an optical mechanism 15 for shaping a laser beam 14 transmitted through optical fiber 2, and making the laser beam go toward a processing point of a workpiece 10; and a water flow nozzle 17 attached to the optical mechanism 15, for discharging water flow toward a cutting part. The laser processing device further has: a recovery nozzle 9 for recovering the water flow coming from the vicinity of the processing point, and molten and removed objects 11 formed of a part of the workpiece 10 having been melted by irradiating the processing point with the laser beam 14; a recovery unit 7 for receiving the water flow and the molten and removed objects 11 recovered from the recovery nozzle 9, and separating the molten and removed objects 11 from water; and controllers 19, 20 for driving the processing head 3 and the recovery nozzle 9 in conjunction with each other.
Inventors:
SHIIHARA KATSUNORI
KONO WATARU
SENDA ITARU
SUZUKI ATSUSHI
KONO WATARU
SENDA ITARU
SUZUKI ATSUSHI
Application Number:
JP2014135194A
Publication Date:
January 28, 2016
Filing Date:
June 30, 2014
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B23K26/146; B23K26/08; B23K26/122; G21F9/30
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office