Title:
LASER PROCESSING APPARATUS, METHODS OF LASER-PROCESSING WORKPIECES, AND RELATED ARRANGEMENTS
Document Type and Number:
Japanese Patent JP2021181121
Kind Code:
A
Abstract:
To provide new functionality capable of improving techniques and apparatus for laser-processing workpieces.SOLUTION: Some embodiments relate to processing of workpieces in a manner for enhancing the accuracy, throughput, etc. Other embodiments relate to real-time Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc. in order to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.SELECTED DRAWING: Figure 1
Inventors:
MARK UNRATH
YANG CHUAN
JAN KLEINERT
MARK PEEPLES
HUGH OWENS
GWENDOLYN BYRNE
ZHANG HAIBIN
JUSTIN REDD
CORIE NEUFELD
JAMES BROOKHYSER
OSAKO YASUSHI
MEHMET ALPAY
LIN ZHIBIN
PATRICK REICHEL
TIM NUCKOLLS
MATSUMOTO HISASHI
CHRIS RYDER
YANG CHUAN
JAN KLEINERT
MARK PEEPLES
HUGH OWENS
GWENDOLYN BYRNE
ZHANG HAIBIN
JUSTIN REDD
CORIE NEUFELD
JAMES BROOKHYSER
OSAKO YASUSHI
MEHMET ALPAY
LIN ZHIBIN
PATRICK REICHEL
TIM NUCKOLLS
MATSUMOTO HISASHI
CHRIS RYDER
Application Number:
JP2021122216A
Publication Date:
November 25, 2021
Filing Date:
July 27, 2021
Export Citation:
Assignee:
ELECTRO SCIENT IND INC
International Classes:
B23K26/382; B23K26/064; B23K26/082
Domestic Patent References:
| JP2009538539A | 2009-11-05 | |||
| JP2003136266A | 2003-05-14 |
Foreign References:
| US20040173589A1 | 2004-09-09 | |||
| DE10249868B3 | 2004-04-29 |
Attorney, Agent or Firm:
Tomohiro Mori